Chem 20 SM particle counter enables inline monitoring of critical solvent chemistries in hazardous semiconductor manufacturing environments.
NIWOT, Colo. – Particle Measuring Systems (PMS), a global leader in contamination monitoring solutions, announces the launch of the Chem 20™ SM, a 20 nm solvent particle counter engineered for use in hazardous areas. Designed to monitor solvents such as IPA and PGMEA, the Chem 20 SM provides reliable inline particle monitoring with hazardous-area certifications without the customer-built containment enclosures commonly used today.
Semiconductor manufacturers have long faced challenges monitoring particles in hazardous solvent environments. Traditional approaches often require expensive, custom-built nitrogen-purged enclosures around standard particle counters, adding complexity, cost, and maintenance requirements. The Chem 20 SM is a self-contained solution designed specifically for hazardous-area installation, helping simplify deployment while maintaining critical contamination control.
“The Chem 20 SM was developed to solve a longstanding challenge for semiconductor manufacturers,” said Badr Astiphan, Vice President of Particle Measuring Systems. “By combining 20 nm particle detection with hazardous-area certification and a compact, installable design, we enable customers to monitor critical solvent chemistries more efficiently and confidently.”
Key benefits of the Chem 20 SM include:
- Designed for hazardous-area solvent monitoring with multiple built-in safety features.
- Compact, inline design that requires less installation space.
- Lower implementation costs compared to secondary containment enclosure solutions.
- Continuous 24/7 monitoring with local and remote data access.
- Optimized for high-purity solvent applications, including IPA and lithography solvents.
The Chem 20 SM will meet global hazardous-location requirements, including IECEx, ATEX, and NFPA 70 NEC Class I Division 2 standards.
With the Chem 20 SM, semiconductor manufacturers and chemical suppliers can monitor contamination closer to the process, identify yield-limiting particle events earlier, and simplify hazardous-area deployment without sacrificing performance or safety.
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